Study on Grinding Force of Two-Dimensional Ultrasonic Vibration Grinding 2.5D-C/SiC Composite Material

Abstract

The grinding force is an important index during the grinding process, which affects the surface quality and other aspects after machining. However, the research on the grinding force of ceramic matrix composites assisted by two-dimensional ultrasonic vibration-assisted grinding is very weak. In this paper, the impact of the relationship between the critical cutting depth and the maximum undeformed chip thickness on the removal mode of ceramic matrix composites was analyzed. On this basis, the grinding force model of two-dimensional ultrasonic vibration-assisted grinding were developed for ductile removal and brittle removal, respectively. Finally, the correctness of the model was verified, and the impact of grinding parameters on the grinding force was analyzed. The experimental results show that compared with the conventional grinding force, the two-dimensional ultrasonic vibration assisted grinding force decreases obviously. When the feed rate and grinding depth increase, the grinding force increases. When the grinding velocity and ultrasonic amplitude increase, the grinding force decreases. Compared with the experimental value, the average relative error of normal grinding force is 8.49%, and the average relative error of tangential grinding force is 13.59%. The experimental and theoretical values of the grinding force have a good fitting relationship.