Manufacturing of High Conductivity, High Strength Pure Copper with Ultrafine Grain Structure

Abstract

Applications of Copper (Cu) range from small scale applications such as microelectronics interconnects to very large high-powered applications such as railguns. In all these applications, Cu conductivity and ampacity play vital roles. In some applications such as railguns, where Cu also plays a structural role, not only is high conductivity needed, but high strength, high ductility, and high wear resistance are also critical. Current technologies have achieved their full potential for producing better materials. New approaches and technologies are needed to develop superior properties. This research examines a new fabrication approach that is expected to produce Cu with superior mechanical strength, enhanced wear resistance, and increased electrical conductivity. Materials with refined grain structures were obtained by breaking down the coarse-grained Cu particles via cryogenic ball milling, followed by the consolidation of powders using cold isostatic pressing (CIP) and subsequent Continuous Equal Channel Angular Pressing (C-ECAP). The mixture of fine and ultrafine grains, with sizes between 200 nm to 2.5 µm and an average of 500 nm, was formed after ball milling at cryogenic temperatures. Further processing via C-ECAP produced nanostructured Cu with average grain sizes below 50 nm and excellent homogenous equiaxed grain shapes and random orientations. The hardness and tensile strength of the final Cu were approximately 158% and 95% higher than the traditional coarse-grained Cu bar, respectively. This material also displayed a good electrical conductivity rate of 74% International Annealed Copper Standard (IACS), which is comparable to the current Cu materials used in railgun applications.