A Piezoresistive Sensor with High Sensitivity and Flexibility Based on Porous Sponge

Abstract

Chemical plating has recently been employed for the preparation of flexible piezoresistive sensors; however, plating solutions and processes that affect the sensitivity still need further exploration. In the study, a sponge-based flexible sensor with copper as its conductive material is prepared using electroless plating. The variation in sponge resistance and sensitivity changes with different plating times are studied. It is found that, with the increasing plating time, the conductivity increases and the resistance of sample will decrease. Moreover, the range of resistance difference will decrease under compression, thus the sensitivity decreases. Furthermore, the sensor’s applications were assessed, verifying the practicability of the developed preparation method. This study may bring ideas for the new development of flexible pressure sensors.