Fragmentation Mechanism in a Nitrogen Dielectric Barrier Discharge Plasma on Fluoropolymer Polymer Films

Author:

Fotouhiardakani FaeghehORCID,Laurent MorganeORCID,Profili JacopoORCID,Ravichandran Sethumadhavan,Dorairaju Gowri,Laroche GaetanORCID

Abstract

Due to their chemical inertness and low friction coefficient, fluoropolymers are today widely employed in sectors of activity as diverse and distinct as the textile industry, architectural sector, and medicine. However, their low surface energy results in poor adhesion, for example, when used for a component in a composite device with multiple other materials. Among the techniques used to enhance their adhesion, atmospheric pressure discharges provide a fast and low-cost method with a reduced environmental impact. Although this approach has proven to be efficient, the different chemical and physical processes in the discharge remain not fully understood. In this study, fluoropolymer surfaces were modified using an atmospheric pressure dielectric barrier discharge in a nitrogen and organic precursor environment. To prevent any damage to fluoropolymer surfaces, the dissipated power in the discharges was tuned by applying a duty cycle. Evidence shows that plasma treatment allows for the incorporation of oxygen and nitrogen in the surface resulting in the formation of hydrophilic functionalities such as carbonyl groups both in ketone and amide form, amine, and hydroxyl groups after 180 s of treatment. Overall, the data reveal that the discharge duty cycle has more effect on the oxygen and carbon content in the coating than the precursor concentration. In addition, increasing the precursor concentration limits the molecular fragmentation and nitrogen incorporation into the coating. These experiments enable the building of a better fundamental understanding of the formation mechanism of such chemical moieties at the fluoropolymer surface.

Funder

Natural Science and Engineering Research Council (NSERC) of Canada

Saint-Gobain Research North America

Publisher

MDPI AG

Subject

General Materials Science

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