Comparative Analysis of the Effect of Cutting Piezoelectric Ceramics on Optically Oriented Compensation Capability

Author:

Li Bo12,Tian Dapeng12ORCID

Affiliation:

1. The Key Laboratory of Airborne Optical Imaging and Measurement, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China

2. University of Chinese Academy of Sciences, Beijing 100049, China

Abstract

In a photoelectric tracking system, a deformable mirror can be used to adjust the transmission path of a light beam to achieve accurate measurement and tracking of the target position. The single-piezoelectric-sheet deformable mirror is a commonly used wavefront correction device with outstanding advantages, such as its simple structure, low cost, and easy preparation. However, it usually has a large cross-linking value and a weak ability to correct higher-order wavefront aberrations. To solve this problem, a novel single-piezoelectric-sheet deformable mirror driving structure is proposed in this paper, in which the coupling between the driving units is weakened by laser cutting the piezoelectric ceramics along the electrode gaps to reduce the cross-linking value of the deformable mirror. In order to verify the effectiveness of this driving structure, this paper takes the 85-unit single-piezoelectric-sheet deformable mirror as an example and simulates the influence function for different cutting depth conditions. The simulation results show that the cross-linking value between neighboring drive units decreases significantly as the piezoelectric-ceramic-laser cutting depth of the drive electrode gap increases. When the piezoelectric ceramic was laser cut to a depth of half of the overall thickness, the cross-linking value decreased by 6.8%.

Funder

CAS Project for Young Scientists in Basic Research

National Defense Science and Technology of the Chinese Academy of Sciences

National Science Foundation of China

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Jilin Province

Publisher

MDPI AG

Subject

Radiology, Nuclear Medicine and imaging,Instrumentation,Atomic and Molecular Physics, and Optics

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