Highly Durable Antimicrobial Tantalum Nitride/Copper Coatings on Stainless Steel Deposited by Pulsed Magnetron Sputtering

Abstract

Highly durable and antimicrobial tantalum nitride/copper (TaN/Cu) nanocomposite coatings were deposited on D-9 stainless steel substrates by pulsed magnetron sputtering. The Cu content in the coating was varied in the range of 1.42–35.42 atomic % (at.%). The coatings were characterized by electron probe microanalyzer, X-ray diffraction, scanning electron microscope and atomic force microscope. The antibacterial properties of the TaN/Cu coatings against gram-negative Pseudomonas aeruginosa were evaluated using a cell culture test. The peak hardness and Young’s modulus of TaN/Cu with 10.46 at.% Cu were 24 and 295 GPa, respectively, which amounted to 15 and 41.67% higher than Cu-free TaN. Among all, TaN/Cu with 10.46 at.% exhibited the lowest friction coefficient. The TaN/Cu coatings exhibited significantly higher antibacterial activity than Cu-free TaN against Pseudomonas aeruginosa. On TaN, the bacterial count was about 4 × 106 CFU, whereas it was dropped to 1.2 × 102 CFU in case of TaN/Cu with 10.46 at.% Cu. The bacterial count was decreased from 9 to 6 when the Cu content increased from 25.54 to 30.04 at.%. Live bacterial cells were observed in the SEM images of TaN, and dead cells were found on TaN/Cu. Overall, TaN/Cu with 10.46 at.% Cu was found to be a potential coating composition in terms of higher antimicrobial activity and mechanical durability.