Analysis of Laminated Composite Porous Plate under Sinusoidal Load with Various Boundary Conditions

Author:

Kumar Raushan1,Kumar Ajay2ORCID,Andrzejuk Wojciech3ORCID,Szafraniec Małgorzata4ORCID,Barnat-Hunek Danuta4ORCID

Affiliation:

1. Department of Civil Engineering, Gaya College of Engineering, Gaya 823003, India

2. Department of Civil Engineering, National Institute of Technology Delhi, Delhi 110036, India

3. Faculty of Technical Sciences, John Paul II University in Biala Podlaska, Sidorska 95/97, 21-500 Biała Podlaska, Poland

4. Faculty of Civil Engineering and Architecture, Lublin University of Technology, Nadbystrzycka 40, 20-618 Lublin, Poland

Abstract

Bending analysis was carried out for a laminated composite porous plate due to sinusoidal loading with various boundary conditions using improved third-order theory. Zero transverse shear stress provided a free surface at the top and bottom of the plate. Also, the authors developed a finite element formulation based on improved third-order shear deformation theory. To circumvent the C1 continuity requirement associated with improved third-order shear deformation theory, a C0 FE formulation was developed by replacing the out-of-plane derivatives with independent field variables. An in-house FORTRAN code was developed for the bending analysis of the laminated porous plate considering a 2D finite element model. The complete thickness of the plate was covered with different porosity patterns. The impacts of various modulus ratios, boundary conditions, thickness ratios, fiber orientation angles, and material parameters were examined for laminated porous plates. There was an 18.8% reduction in deflection in the case of the square plate as compared to rectangular plates, with a porosity value of 0.1, a thickness ratio of 10, and an orientation angle of 0°/90°/0°. According to the current research, adding porosities causes a relatively greater change in deflection rather than stress, thereby aiding in the development of a lightweight structure.

Funder

Ministry of Science and Higher Education – Poland

Publisher

MDPI AG

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