Effects of Acoustic Black Hole Parameters and Damping Layer on Sound Insulation Performance of ABH Circular Plate

Author:

Du XiaofeiORCID,Huang Dacheng,Fu Qidi,Zhang Jianrun

Abstract

The acoustic black hole (ABH) can be utilized to achieve aggregation of flexural wave in structures with the feature that the thickness gradually reduced to zero with a power exponent no less than 2. The above characteristics could be applied in vibration reduction, noise attenuation or improving sound insulation. Previous literatures on vibration and acoustic characteristics of ABH structures mainly focus on the structural response under mechanical force excitation, while the transmission loss (TL) of circular plates embedded with two-dimensional ABHs investigated in this paper is a vibro-acoustic coupling procedure under excitation of diffuse sound field. Series of vibro-acoustic coupling finite element models (FEM) for TL analysis of ABH circular plates were established by automatic matched layer (AML) method in this paper and an experimental platform for measuring TLs of ABH circular plates and uniform plates was constructed. The accuracy of the FEM analysis was verified by experimental measurements. To systematically analyze the influence mechanism of parameters of the ABH on TLs of ABH circular plates, the effects of diameter, orientation, number, and truncation thickness of ABHs on TLs of ABH circular plates were further studied. The effect of the damping layer on TLs of circular plates embedded with 1 and 19 ABHs was also analyzed and it reveals that the influence of damping layer mainly concentrates on the first-order resonance frequency and damping-controlled region of the plate, and at some frequencies, the greater the damping layer thickness, the worse the sound insulation performance, despite that the modal damping loss factor has been increased in the whole frequency domain.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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