A Novel Technique for Substrate Toughening in Wood Single Lap Joints Using a Zero-Thickness Bio-Adhesive

Author:

Jalali Shahin1,Borges Catarina da Silva Pereira1,Carbas Ricardo João Camilo12ORCID,Marques Eduardo André de Sousa2,Akhavan-Safar Alireza1ORCID,Barbosa Ana Sofia Oliveira Ferreira1,Bordado João Carlos Moura3,da Silva Lucas Filipe Martins2ORCID

Affiliation:

1. Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), Rua Dr. Roberto Frias, 4200-465 Porto, Portugal

2. Departamento de Engenharia Mecânica, Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal

3. Centro de Recursos Naturais E Ambiennte (CERENA), Instituto Superior Técnico, University of Lisbon, 1049-001 Lisbon, Portugal

Abstract

In contemporary engineering practices, the utilization of sustainable materials and eco-friendly techniques has gained significant importance. Wooden joints, particularly those created with polyurethan-based bio-adhesives, have garnered significant attention owing to their intrinsic environmental advantages and desirable mechanical properties. In comparison to conventional joining methods, adhesive joints offer distinct benefits such as an enhanced load distribution, reduced stress concentration, and improved aesthetic appeal. In this study, reference and toughened single-lap joint samples were investigated experimentally and numerically under quasi-static loading conditions. The proposed research methodology involves the infusion of a bio-adhesive into the wooden substrate, reinforcing the matrix of its surfaces. This innovative approach was developed to explore a synergetic effect of both wood and bio-adhesive. The experimentally validated results showcase a significant enhancement in joint strength, demonstrating an 85% increase when compared to joints with regular pine substrates. Moreover, the increased delamination thickness observed in toughened joints was found to increase the energy absorption of the joint.

Funder

Fundação para a Ciência e Tecnologia

Publisher

MDPI AG

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