The Microzone Structure Regulation of Diamond/Cu-B Composites for High Thermal Conductivity: Combining Experiments and First-Principles Calculations
Author:
Affiliation:
1. State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co., Ltd., Beijing 101400, China
2. GRIMAT Engineering Institute Co., Ltd., Beijing 101400, China
3. General Research Institute for Nonferrous Metals, Beijing 100088, China
Abstract
Funder
Ministry of Science and Technology of the People’s Republic of China
Youth Fund Project of GRINM
Publisher
MDPI AG
Subject
General Materials Science
Link
https://www.mdpi.com/1996-1944/16/5/2021/pdf
Reference28 articles.
1. Xie, Z., Guo, H., Zhang, X., and Huang, S. (2019). Enhancing thermal conductivity of Copper/diamond composites by regulating distribution of bimodal diamond particles. Diam. Relat. Mater., 100.
2. Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond;Chang;Acta Mater.,2018
3. Sun, Y., He, L., Zhang, C., Meng, Q., Liu, B., Gao, K., Wen, M., and Zheng, W. (2017). Enhanced tensile strength and thermal conductivity in copper diamond composites with B4C coating. Sci. Rep., 7.
4. Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix;Bai;Mater. Charact.,2019
5. Design of interfacial Cr3C2 carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications;Kruszewski;Mater. Des.,2017
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