Flexible Symmetric-Defection Antenna with Bending and Thermal Insensitivity for Miniaturized UAV

Author:

Nan Xueli12,Kang Tongtong1,Zhang Zhonghe3,Wang Xin1ORCID,Zhang Jiale1ORCID,Lei Yusheng4,Gao Libo4,Cui Jianli5,Xu Hongcheng6

Affiliation:

1. School of Automation and Software Engineering, Shanxi University, Taiyuan 030006, China

2. School of Biomedical Engineering, Shanghai Jiao Tong University, Shanghai 200030, China

3. College of Electronics and Information Engineering, Shenzhen University, Shenzhen 518061, China

4. Pen-Tung Sah Institute of Micro-Nano Science and Technology, Xiamen University, Xiamen 361102, China

5. School of Physics and Electronics Engineering, Yuncheng University, Yuncheng 044000, China

6. School of Instrument Science and Technology, Xi’an Jiaotong University, Xi’an 710049, China

Abstract

Flexible conformal-enabled antennas have great potential for various developable surface-built unmanned aerial vehicles (UAVs) due to their superior mechanical compliance as well as maintaining excellent electromagnetic features. However, it remains a challenge that the antenna holds bending and thermal insensitivity to negligibly shift resonant frequency during conformal attachment and aerial flight, respectively. Here, we report a flexible symmetric-defection antenna (FSDA) with bending and thermal insensitivity. By engraving a symmetric defection on the reflective ground, the radiated unit attached to the soft polydimethylsiloxane (PDMS) makes the antenna resonate at the ISM microwave band (resonant frequency = 2.44 GHz) and conformal with a miniaturized UAV. The antenna is also insensitive to both the bending-conformal attachment (20 mm < r < 70 mm) and thermal radiation (20~100 °C) due to the symmetric peripheral-current field along the defection and the low-change thermal effect of the PDMS, respectively. Therefore, the antenna in a non-bending state almost keeps the same impedance matching and radiation when it is attached to a cylinder-back of a UAV. The flexible antenna with bending and thermal insensitivity will pave the way for more conformal or wrapping applications.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Xiaomi Young Talents Program/Xiaomi Foundation

Publisher

MDPI AG

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