The Growth of Intermetallic Compounds and Its Effect on Bonding Properties of Cu/Al Clad Plates by CFR

Abstract

Cu/Al clad plates prepared using a corrugated + flat rolling (CFR) technique were annealed at 300–450 °C for 10–240 min. Furthermore, the interfacial diffusion behavior and the bonding properties of the Cu/Al clad plates were studied in detail. The results demonstrated that, at the initial stage of the annealing process, the development of the first IMCs layer was restrained by the high atomic concentration gradient in the new bonding interface zone, and the second intermetallic compounds (IMCs) layer preferentially formed in the new bonding interface zone, leading to a slight increase in the growth activation energy of the clad plates. In addition, the atoms’ diffusion behavior at the peak and trough interfaces was not significantly affected by the matrix microstructure, and there was no discernible difference in the growth activation energy at these two positions. Ultimately, it was shown that the maximum average peel strength at the peak and trough interfaces reached 53.07 N/mm and 41.23 N/mm, respectively, when annealing at 350 °C for 10 min.