A Multiscale Modeling and Experimental Study on the Tensile Strength of Plain-Woven Composites with Hybrid Bonded–Bolted Joints

Author:

Shi Jianwei1,Zhang Junwei1,Du Kou2,Guo Qiming1ORCID,Hou Yuliang1ORCID,Dong Cheng2

Affiliation:

1. School of Mechanical and Power Engineering, Zhengzhou University, Zhengzhou 450001, China

2. Inner Mongolia North Heavy Industries Group Co., Ltd., Baotou 014010, China

Abstract

CFRP hybrid bonded–bolted (HBB) joints combine the advantages of traditional joining methods, namely adhesive bonding, and bolting, to achieve optimal connection performance, making them the most favored connection method. The structural parameters of CFRP HBB joints, including overlap length, bolt-hole spacing, and fit clearance relationships, have a complex impact on connection performance. To enhance the connectivity performance of joint structures, this paper develops a multiscale finite element analysis model to investigate the impact of structural parameters on the strength of CFRP HBB joint structures. Coupled with experimental validation, the study reveals how changes in structural parameters affect the unidirectional tensile failure force of the joints. Building on this, an analytical approach and inverse design methodology for the mechanical properties of CFRP HBB joints based on deep supervised learning algorithms are developed. Neural networks accurately and efficiently predict the performance of joints with unprecedented combinations of parameters, thus expediting the inverse design process. This research combines experimentation and multiscale finite element analysis to explore the unknown relationships between the mechanical properties of CFRP HBB joints and their structural parameters. Furthermore, leveraging DNN neural networks, a rapid calculation method for the mechanical properties of hybrid joints is proposed. The findings lay the groundwork for the broader application and more intricate design of composite materials and their connection structures.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

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