Investigating Cross-Linking Parameters and Molecular Arrangement in Liquid Crystalline Epoxy Monomer with Aromatic Diamine: DSC-TOPEM® and WAXS Analysis

Author:

Zając Weronika1ORCID,Mossety-Leszczak Beata2ORCID,Kisiel Maciej2ORCID,Włodarska Magdalena3ORCID,Szałański Piotr4

Affiliation:

1. Doctoral School of the Rzeszow University of Technology, al. Powstańców Warszawy 12, 35-959 Rzeszow, Poland

2. Department of Industrial and Materials Chemistry, Rzeszow University of Technology, al. Powstańców Warszawy 6, 35-959 Rzeszow, Poland

3. Institute of Physics, Lodz University of Technology, Wólczańska 217/221, 93-005 Lodz, Poland

4. Laboratory of Spectrometry, Rzeszow University of Technology, al. Powstańców Warszawy 12, 35-959 Rzeszow, Poland

Abstract

This study presents the characterization of cross-linking parameters of a liquid crystalline epoxy monomer with an aromatic diamine as a curing agent. The mixture tested consisted of bis [4-(10,11-epoxyundecanoyloxy)benzoate] p-phenylene (LCEM) and 1,3-phenylenediamine (1,3-PDA). This paper focuses on the structural characterization of such systems using X-ray analysis. To investigate this, a comprehensive analysis was conducted using Differential Scanning Calorimetry (DSC) and Wide-Angle X-ray Scattering (WAXS). Through DSC analysis, the curing behavior and transition temperature of the liquid crystal epoxy system were established. To fully characterize the cross-linking of the system, a novel technique called DSC-TOPEM® was employed. The use of this technique enabled real-time monitoring of the curing process and provided precise information on the cross-linking energy, which resulted in the finding that the mixture was cross-linking faster than expected. WAXS analysis was performed to assess the structural changes formed during the cross-linking. The results of this analysis confirm that lower cross-linking temperatures of the mixture cause better ordering of mesogens than higher ones.

Funder

Minister of Science and Higher Education Republic of Poland

Publisher

MDPI AG

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