Solid State Additive Manufacturing of Thermoset Composites

Author:

Hong Bo12,Wang Kaifeng13ORCID,Li Yang4ORCID,Ren Shuhan3,Gu Peihua13

Affiliation:

1. Key Laboratory of Mechanism Theory and Equipment Design of Ministry of Education, Tianjin University, Tianjin 300354, China

2. Intelligent Manufacturing Key Laboratory of Ministry of Education, Shantou University, Shantou 515063, China

3. International Institute for Innovative Design and Intelligent Manufacturing Tianjin University in Zhejiang, Shaoxing 312000, China

4. School of Materials Science and Engineering, Tianjin University, Tianjin 300354, China

Abstract

Softening and subsequent deformation are significant challenges in additive manufacturing of thermal-curable thermosets. This study proposes an approach to address these issues, involving the preparation of thermosetting composite powders with distinct curing temperatures, the utilization of cold spray additive manufacturing (CSAM) for sample fabrication, and the implementation of stepwise curing for each component. To validate the feasibility of this approach, two single-component thermosetting powders P1 and P2 and their composite powder C were subjected to CSAM and stepwise curing. From the sample morphology observation and deposition/curing mechanism investigation based on thermomechanical analysis and differential scanning calorimetry, it is found that severe plastic deformation occurs during the CSAM process, accompanied by heat generation, leading to local melting to promote a good bond at the contact surface of the particles and form small pores. During the progressive curing, the samples printed using C demonstrate superior deformation resistance compared with those using P1 and P2, and the curing time is reduced from 16.7 h to 1.5 h, due to the sequential curing reactions of P1 and P2 components in composite C, allowing the uncured P2 and cured P1 to alternately remain solid for providing structural support and minimizing deformation.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

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