Performance of High-Layer-Thickness Ti6Al4V Fabricated by Electron Beam Powder Bed Fusion under Different Accelerating Voltage Values

Author:

Li Hongxin,Liang XiaoyuORCID,Li Yang,Lin Feng

Abstract

The electron beam powder bed fusion (EB-PBF) process is typically carried out using a layer thickness between 50 and 100 μm with the accelerating voltage of 60 kV for the electron beam. This configuration ensures forming accuracy but limits building efficiency. The augmentation of the accelerating voltage enlarges the molten pool due to the rise in penetrability, suggesting that a higher layer thickness can be used. Therefore, the effects of layer thickness and accelerating voltage were investigated simultaneously in this study to explore the feasibility of efficiency improvement. Ti6Al4V was fabricated by EB-PBF using layer thicknesses of 200 and 300 μm. Two accelerating voltage values of 60 and 90 kV were used to study their effects under expanded layer thickness. The results reveal that dense parts with the ultimate tensile strength higher than 950 MPa and elongation higher than 9.5% could be fabricated even if the layer thickness reached 300 μm, resulting in a building rate of up to 30 mm3/s. The expansion of the layer thickness could decrease the minimum bulk energy density needed to fabricate dense parts and increase the α platelet thickness, which improved the energy efficiency. However, expanding layer thickness had a significant negative effect on surface roughness, but it could be improved by applying augmented accelerating voltage.

Funder

the National Key R&D Program of China

Publisher

MDPI AG

Subject

General Materials Science

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3