Paper-Based Bi-Material Cantilever Actuator Bending Behavior and Modeling

Author:

Chen Gordon1,Kumar Ashutosh1ORCID,Heidari-Bafroui Hojat1ORCID,Smith Winfield1,Charbaji Amer1ORCID,Rahmani Nassim1,Anagnostopoulos Constantine1,Faghri Mohammad1

Affiliation:

1. Microfluidics Laboratory, Department of Mechanical, Industrial and Systems Engineering, University of Rhode Island, 2 East Alumni Avenue, Kingston, RI 02881, USA

Abstract

In this paper, the behavior of the Bi-Material Cantilever (B-MaC) response deflection upon fluidic loading was experimentally studied and modeled for bilayer strips. A B-MaC consists of a strip of paper adhered to a strip of tape. When fluid is introduced, the paper expands while the tape does not, which causes the structure to bend due to strain mismatch, similar to the thermal loading of bi-metal thermostats. The main novelty of the paper-based bilayer cantilevers is the mechanical properties of two different types of material layers, a top layer of sensing paper and a bottom layer of actuating tape, to create a structure that can respond to moisture changes. When the sensing layer absorbs moisture, it causes the bilayer cantilever to bend or curl due to the differential swelling between the two layers. The portion of the paper strip that gets wet forms an arc, and as the fluid advances and fully wets the B-MaC, the entire B-MaC assumes the shape of the initial arc. This study showed that paper with higher hygroscopic expansion forms an arc with a smaller radius of curvature, whereas thicker tape with a higher Young’s modulus forms an arc with a larger radius of curvature. The results showed that the theoretical modeling could accurately predict the behavior of the bilayer strips. The significance of paper-based bilayer cantilevers lies in their potential applications in various fields, such as biomedicine, and environmental monitoring. In summary, the novelty and significance of paper-based bilayer cantilevers lie in their unique combination of sensing and actuating capabilities using a low-cost and environmentally friendly material.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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