Multi-Level Resistive Al/Ga2O3/ITO Switching Devices with Interlayers of Graphene Oxide for Neuromorphic Computing

Author:

Wang Li-Wen1,Huang Chih-Wei2,Lee Ke-Jing23ORCID,Chu Sheng-Yuan1ORCID,Wang Yeong-Her23ORCID

Affiliation:

1. Department of Electrical Engineering, National Cheng-Kung University, Tainan 701, Taiwan

2. Institute of Microelectronics, Department of Electrical Engineering, National Cheng-Kung University, Tainan 701, Taiwan

3. Program on Semiconductor Process Technology, Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng-Kung University, Tainan 701, Taiwan

Abstract

Recently, resistive random access memory (RRAM) has been an outstanding candidate among various emerging nonvolatile memories for high-density storage and in-memory computing applications. However, traditional RRAM, which accommodates two states depending on applied voltage, cannot meet the high density requirement in the era of big data. Many research groups have demonstrated that RRAM possesses the potential for multi-level cells, which would overcome demands related to mass storage. Among numerous semiconductor materials, gallium oxide (a fourth-generation semiconductor material) is applied in the fields of optoelectronics, high-power resistive switching devices, and so on, due to its excellent transparent material properties and wide bandgap. In this study, we successfully demonstrate that Al/graphene oxide (GO)/Ga2O3/ITO RRAM has the potential to achieve two-bit storage. Compared to its single-layer counterpart, the bilayer structure has excellent electrical properties and stable reliability. The endurance characteristics could be enhanced above 100 switching cycles with an ON/OFF ratio of over 103. Moreover, the filament models are also described in this thesis to clarify the transport mechanisms.

Funder

Ministry of Science and Technology of Taiwan

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

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