Throughput/Area Optimized Architecture for Elliptic-Curve Diffie-Hellman Protocol

Author:

Rashid MuhammadORCID,Kumar HarishORCID,Khan Sikandar ZulqarnainORCID,Bahkali IsmailORCID,Alhomoud AhmedORCID,Mehmood ZahidORCID

Abstract

This paper presents a high-speed and low-area accelerator architecture for shared key generation using an elliptic-curve Diffie-Hellman protocol over GF(2233). Concerning the high speed, the proposed architecture employs a two-stage pipelining and a Karatsuba finite field multiplier. The use of pipelining shortens the critical path which ultimately improves the clock frequency. Similarly, the employment of a Karatsuba multiplier decreases the required number of clock cycles. Moreover, an efficient rescheduling of point addition and doubling operations avoids data hazards that appear due to pipelining. Regarding the low area, the proposed architecture computes finite field squaring and inversion operations using the hardware resources of the Karatsuba multiplier. Furthermore, two dedicated controllers are used for efficient control functionalities. The implementation results after place-and-route are provided on Virtex-7, Spartan-7, Artix-7 and Kintex-7 FPGA (field-programmable gate arrays) devices. The utilized FPGA slices are 5102 (on Virtex-7), 5634 (on Spartan-7), 5957 (on Artix-7) and 6102 (on Kintex-7). In addition to this, the time required for one shared-key generation is 31.08 (on Virtex-7), 31.68 (on Spartan-7), 31.28 (on Artix-7) and 32.51 (on Kintex-7). For performance comparison, a figure-of-merit in terms of throughputarea is utilized which shows that the proposed architecture is 963.3 and 2.76 times faster as compared to the related architectures. In terms of latency, the proposed architecture is 302.7 and 132.88 times faster when compared to the most relevant state-of-the-art approaches. The achieved results and performance comparison prove the significance of presented architecture in all those shared key generation applications which require high speed with a low area.

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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