The Influence of the Interface on the Micromechanical Behavior of Unidirectional Fiber-Reinforced Ceramic Matrix Composites: An Analysis Based on the Periodic Symmetric Boundary Conditions

Author:

Yan Wei12,Shi Shilun13,Xiao Longcheng14,Li Xiulun14,Xu Jian15

Affiliation:

1. Zhejiang Key Laboratory of Data-Driven High-Safety Energy Materials and Applications, Ningbo Key Laboratory of Special Energy Materials and Chemistry, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China

2. University of Chinese Academy of Sciences, Beijing 100049, China

3. School of Material Science and Chemical Engineering, Ningbo University, Ningbo 315211, China

4. School of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310018, China

5. Engineering Laboratory of Advanced Energy Materials, Ningbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China

Abstract

The long-term periodicity and uncontrollable interface properties during the preparation process for silicon carbide fiber reinforced silicon carbide-based composites (SiCf/SiC CMC) make it difficult to thoroughly investigate their mechanical damage behavior under complex loading conditions. To delve deeper into the influence of the interface strength and toughness on the mechanical response of microscopic representative volume element (RVE) models under complex loading conditions, in this work, based on numerical simulation methods, a microscale representative volume element (RVE) with periodic symmetric boundary conditions for the material is constructed. The phase-field fracture theory and cohesive zone model are coupled to capture the brittle cracking of the matrix and the debonding behavior at the fiber/matrix interface. Simulation analysis is conducted for tensile, compressive, and shear loading as well as combined loading, and the validity of the model is verified based on the Chamis theory. Further investigation is conducted into the mechanical response behavior of the microscale RVE model under complex loading conditions in relation to the interface strength and interface toughness. The results indicate that under uniaxial loading, increasing the interface strength leads to a tighter bond between the fiber and matrix, suppressing crack initiation and propagation, and significantly increasing the material’s fracture strength. However, compared to the transverse compressive strength, increasing the interface strength does not continuously enhance the strength under other loading conditions. Meanwhile, under the condition of strong interface strength of 400 MPa, an increase in the interface toughness significantly increases the transverse compressive strength of the material. When it increases from 2 J/m2 to 20 J/m2, the transverse compressive strength increases by 28.49%. Under biaxial combined loading, increasing the interface strength significantly widens the failure envelope space under σ2-τ23 combined loading; with the transition from transverse compressive stress to tensile stress, the transverse shear strength shows a trend of first increasing and then decreasing, and when the ratio of transverse shear displacement to transverse tensile/compressive displacement is −1, it reaches the maximum. This study provides strong numerical support for the investigation of the interface properties and mechanical behavior of SiCf/SiC composites under complex loading conditions, offering important references for engineering design and material performance optimization.

Funder

National Natural Science Foundation of China

Ningbo 3315 Plan Innovation Team

Fundamental Research Funds for the Central Universities

Publisher

MDPI AG

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3