Microstructural Evolution during Accelerated Tensile Creep Test of ZK60/SiCp Composite after KoBo Extrusion

Author:

Wang Yang-Yang,Jia Chen,Tayebi MortezaORCID,Hamawandi BejanORCID

Abstract

In the current study, the creep properties of magnesium alloy reinforced with SiC particles were investigated. For this purpose, ZK60/SiCp composite was produced by the stir casting method following the KoBo extrusion and precipitation hardening processes. The creep tests were performed at 150 °C under 10–110 MPa. The results showed that the stress exponent (n) and the average true activation energy (Q) was changed at high stresses, was found with increasing stress, the creep mechanism changing from grain boundary sliding to dislocation climb. The results of microstructure characterization after the creep test showed that at low stresses, the dynamic recrystallization resulting from twinning induced the GBS mechanism. However, at high stresses, with increasing diffusion rates, conditions are provided for dynamic precipitation and the dislocation climb of the dominant creep mechanism. Examination of the fracture surfaces and the surrounding areas showed that the cavity nucleation in the ternary boundary and surrounding precipitation was the main cause of damage. The evaluation of the samples texture after creep showed that the unreinforced alloy showed a moderately strong fiber texture along the angle of ϕ1 = 0–90°, which was tilted about Φ = 10°. A new strong texture component was observed at (90°, 5°, 0°) for the composite sample, which crept due to minor splitting of the basal pole by ~5° toward RD.

Publisher

MDPI AG

Subject

General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3