Preparation of Thermally Conductive Silicone Rubber-Based Ultra-Thin Sheets with Low Thermal Resistance and High Mechanical Properties

Author:

Liu Mengqi123,Tong Shengfu4,Guo Xinhua12,Ye Jing1,Liu Jianping13,Bao Chenlu123

Affiliation:

1. School of Material Science and Engineering, Tiangong University, 399 Binshui West Road, Tianjin 300387, China

2. Tianjin HaiTe Thermal Management Technology Co., Ltd., 6 Huake Eight Road, Tianjin 300450, China

3. Sichuan Ximaiwan Technology Co., Ltd., 6668 Section 2 Qingquan Avenue, Chengdu 610300, China

4. Zhejiang Public Information Industry Co., Ltd., A3-3, China Telecom Zhejiang Innovation Park, 8 Xiqin Street, Hangzhou 311100, China

Abstract

Thermally conductive silicone rubber (TCSR)-based thin sheets with low thermal resistance and high electrical insulation properties have been widely used in thermal management applications in the electronic and energy storage fields. The low thermal resistance is mainly attributed to the sheets’ small thickness. In order to further decrease the sheets’ thermal resistance, it is necessary to decrease their thickness. However, the sheets mostly have a thickness of at least 0.20 mm, and it is still a challenge to decrease the thickness to less than 0.10 mm mainly due to the difficulty of smooth calendering through a narrow roll-to-roll gap on calenders. Here, a low-viscosity calendering method has been developed to prepare TCSR-based ultra-thin sheets. The sheets present unprecedentedly small thickness (~0.08 mm), low thermal resistance (0.87 cm2K/W), high tensile strength (~8 MPa), high flexibility, high electrical resistance (>1014 Ω·cm), and high thermal dissipation (>30 °C decrease in LED working temperature). Comparison studies between this new method and the conventional preparation method have been carried out to understand the mechanism of the improvements.

Publisher

MDPI AG

Subject

Process Chemistry and Technology,Chemical Engineering (miscellaneous),Bioengineering

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