Author:
Lee Chi-Yuan,Su Ay,Liu Yin-Chieh,Fan Wei-Yuan,Hsieh Wei-Jung
Subject
Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry
Reference14 articles.
1. Thermal diffusion analysis for LED module;Su;Heat Tran. Asian Res,2007
2. Measurement of junction temperature confirms package thermal design;Siegal;Laser Focus World,2003
3. LED junction temperature test unit operating manual;Shih;Acorn Technology,2003
4. Mechanism and thermal effect of delamination in light-emitting diode packages;Hu;Microelectr. J,2007
5. Thermal resistance measurement of LED package with multichips;Kim;IEEE Trans. Compon. Packaging T,2007
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