Three-Dimensionally Printed Expandable Structural Electronics Via Multi-Material Printing Room-Temperature-Vulcanizing (RTV) Silicone/Silver Flake Composite and RTV
Author:
Lee Ju-Yong1, Oh Min-Ha1ORCID, Park Joo-Hyeon1, Kang Se-Hun1, Kang Seung-Kyun123ORCID
Affiliation:
1. Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea 2. Research Institute of Advanced Materials (RIAM), Seoul National University, Seoul 08826, Republic of Korea 3. Soft Foundry Nano Systems Institute (NSI), Seoul National University, Seoul 08826, Republic of Korea
Abstract
Three-dimensional (3D) printing has various applications in many fields, such as soft electronics, robotic systems, biomedical implants, and the recycling of thermoplastic composite materials. Three-dimensional printing, which was only previously available for prototyping, is currently evolving into a technology that can be utilized by integrating various materials into customized structures in a single step. Owing to the aforementioned advantages, multi-functional 3D objects or multi-material-designed 3D patterns can be fabricated. In this study, we designed and fabricated 3D-printed expandable structural electronics in a substrateless auxetic pattern that can be adapted to multi-dimensional deformation. The printability and electrical conductivity of a stretchable conductor (Ag-RTV composite) were optimized by incorporating a lubricant. The Ag-RTV and RTV were printed in the form of conducting voxels and frame voxels through multi-nozzle printing and were arranged in a negative Poisson’s ratio pattern with a missing rib structure, to realize an expandable passive component. In addition, the expandable structural electronics were embedded in a soft actuator via one-step printing, confirming the possibility of fabricating stable interconnections in expanding deformation via a missing rib pattern.
Funder
National Research Foundation of Korea
Subject
Polymers and Plastics,General Chemistry
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