Thermal Stress Formation in a Functionally Graded Al2O3-Adhesive Single Lap Joint Subjected to a Uniform Temperature Field
Author:
Affiliation:
1. Department of Mechanical Engineering, Erciyes University, 38280 Kayseri, Türkiye
2. Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123, USA
Abstract
Funder
Scientific Research Project Division of Erciyes University
Publisher
MDPI AG
Subject
Applied Mathematics,Computational Mathematics,General Engineering
Link
https://www.mdpi.com/2297-8747/28/4/82/pdf
Reference36 articles.
1. Adams, R.D., and Wake, W.C. (1984). Structural Adhesive Joints in Engineering, Elsevier Applied Science. [1st ed.].
2. Kinloch, A.J. (1987). Adhesion and Adhesives: Science and Technology, Chapman and Hall. [1st ed.].
3. da Silva, L.F.M., and Öchsner, A. (2008). Modeling of Adhesively Bonded Joints, Springer.
4. Thermal stresses in adhesively bonded joints/patches and their modeling;Mittal;Progress in Adhesion and Adhesives,2017
5. Ways to mitigate thermal stresses in adhesively bonded joints/patches;Mittal;Progress in Adhesion and Adhesives,2017
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