Solvent Welding-Based Methods Gently and Effectively Enhance the Conductivity of a Silver Nanowire Network

Author:

Zhu Zhaoxi1,Wang Xiaolu12ORCID,Li Dan1,Yu Haiyang1,Li Xuefei1,Guo Fu123ORCID

Affiliation:

1. Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China

2. Key Laboratory of Advanced Functional Materials, Ministry of Education, Beijing 100124, China

3. School of Mechanical Electrical Engineering, Beijing Information Science and Technology University, Beijing 100192, China

Abstract

To enhance the conductivity of a silver nanowire (Ag NW) network, a facile solvent welding method was developed. Soaking a Ag NW network in ethylene glycol (EG) or alcohol for less than 15 min decreased the resistance about 70%. Further combined solvent processing via a plasmonic welding approach decreased the resistance about 85%. This was achieved by simply exposing the EG-soaked Ag NW network to a low-power blue light (60 mW/cm2). Research results suggest that poly(vinylpyrrolidone) (PVP) dissolution by solvent brings nanowires into closer contact, and this reduced gap distance between nanowires enhances the plasmonic welding effect, hence further decreasing resistance. Aside from this dual combination of methods, a triple combination with Joule heating welding induced by applying a current to the Ag NW network decreased the resistance about 96%. Although conductivity was significantly enhanced, our results showed that the melting at Ag NW junctions was relatively negligible, which indicates that the enhancement in conductivity could be attributed to the removal of PVP layers. Moreover, the approaches were quite gentle so any potential damage to Ag NWs or polymer substrates by overheating (e.g., excessive Joule heating) was avoided entirely, making the approaches suitable for application in devices using heat-sensitive materials.

Funder

National Natural Science Foundation of China

General Program of Science and Technology Development Project of Beijing Municipal Education Commission

Beijing Nova Program

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

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