Analysis and Modeling of Stress–Strain Curves in Microalloyed Steels Based on a Dislocation Density Evolution Model

Author:

Sobotka EvelynORCID,Kreyca JohannesORCID,Poletti Maria CeciliaORCID,Povoden-Karadeniz ErwinORCID

Abstract

Microalloyed steels offer a good combination of desirable mechanical properties by fine-tuning grain growth and recrystallization dynamics while keeping the carbon content low for good weldability. In this work, the dislocation density evolution during hot rolling was correlated by materials modeling with flow curves. Single-hit compression tests at different temperatures and strain rates were performed with varying isothermal holding times prior to deformation to achieve different precipitation stages. On the basis of these experimental results, the dislocation density evolution was evaluated using a recently developed semi-empirical state-parameter model implemented in the software MatCalc. The yield stress at the beginning of the deformation σ0, the initial strain hardening rate θ0, and the saturation stress σ∞—as derived from the experimental flow curves and corresponding Kocks plots—were used for the calibration of the model. The applicability for industrial processing of many microalloyed steels was assured by calibration of the model parameters as a function of temperature and strain rate. As a result, it turned out that a single set of empirical equations was sufficient to model all investigated microalloyed steels since the plastic stresses at high temperatures did not depend on the precipitation state.

Publisher

MDPI AG

Subject

General Materials Science

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3