Space-Filling Curve Resistor on Ultra-Thin Polyetherimide Foil for Strain Impervious Temperature Sensing

Author:

Rager KorbinianORCID,Jaworski David,von der Heide ChrestenORCID,Kyriazis AlexanderORCID,Sinapius MichaelORCID,Constantinou IordaniaORCID,Dietzel AndreasORCID

Abstract

Monitoring process parameters in the manufacture of composite structures is key to ensuring product quality and safety. Ideally, this can be done by sensors that are embedded during production and can remain as devices to monitor structural health. Extremely thin foil-based sensors weaken the finished workpiece very little. Under ideal conditions, the foil substrate bonds with the resin in the autoclaving process, as is the case when polyetherimide is used. Here, we present a temperature sensor as part of an 8 µm thick multi-sensor node foil for monitoring processing conditions during the production and structural health during the lifetime of a construction. A metallic thin film conductor was shaped in the form of a space-filling curve to suppress the influences of resistance changes due to strain, which could otherwise interfere with the measurement of the temperature. FEM simulations as well as experiments confirm that this type of sensor is completely insensitive to the direction of strain and sufficiently insensitive to the amount of strain, so that mechanical strains that can occur in the composite curing process practically do not interfere with the temperature measurement. The temperature sensor is combined with a capacitive sensor for curing monitoring based on impedance measurement and a half-bridge strain gauge sensor element. All three types are made of the same materials and are manufactured together in one process flow. This is the key to cost-effective distributed sensor arrays that can be embedded during production and remain in the workpiece, thus ensuring not only the quality of the initial product but also the operational reliability during the service life of light-weight composite constructions.

Funder

Deutsche Forschungsgemeinschaft

Zentrales Innovationsprogramm Mittelstand

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3