Numerical Simulation and Deformation Behavior of a Ti/Steel Clad Plate during the Rolling Process

Author:

Sun Lirong12,Ding Jingguo1ORCID,Zhang Jiqing2,Li He2,Wang Guodong1

Affiliation:

1. State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang 110819, China

2. Shandong Iron & Steel Group Rizhao Co. Ltd., Rizhao 276800, China

Abstract

The deformation mechanism is complex in the hot rolling process of clad plates, and head bending is a common defect. In this paper, an analytical computational mechanical model of a metal plate was established by the classical elastic mechanics method, and the relationship between uneven thickness extension and warpage was obtained. The hot rolling bonding process of dissimilar bimetallic plates of Ti/Steel was investigated. On this basis, the mechanical origins of the plate bending defects and the influence of various factors on the evolution of the plate bending defects of the metal plates were revealed. The results indicated that the rolling forces increased with the increase in reduction ratio and thickness ratio. As the total reduction ratios of the clad plates increased, the reduction ratio of each layer increased. Furthermore, it was found that the thickness reduction ratios of steel were larger than those of Ti at a certain total reduction ratio, which could reach up to 59.6%. When the reduction ratios were 0.4 and 0.45, the bending degree increased with the thickness ratio of the upper and lower plates increasing gradually. The maximum warpage could reach 0.349 m. The clad plate shape was better when the roll speed ratio was 1.02 and the reduction rate was 0.4. The present numerical results provide a valuable insight into the deformation behaviors and mechanisms involved in the hot rolling of clad plates.

Funder

State Key Laboratory of Rolling and Automation, Northeastern University, China, under the National Key R&D Program of China

National Natural Science Foundation of China

central government guides local funds for science and technology development

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

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