Reliable Method to Detect Alloy Soldering Fractures under Accelerated Life Test

Abstract

In this research, we investigated the development and design of the Accelerated Life Test (ALT) and its approach to the waste of material. The development of a reliability model is based on the moment at which failure appears. The faults detected in welding joints during this research prevented proper current flow within electronic components and this interruption of current is considered a critical system failure. Minitab v18 was used to process data. Through statistical analysis, it was determined that the sample size was adequate with a 95% level of significance. A Shapiro Wilk analysis was carried out to determine the normality of the data, where a p-value of 0.1349 was obtained, which indicates that the data are normal. A Weibull analysis was applied, and it was observed that the data adjusted to the regression analysis and Weibull’s reliability distribution. The results showed that failure phenomena can occur during electronic assembly due to the values of R being too high and too close to each other. Significant issues included the welding alloy, temperature, and the interaction between the welding alloy and vibration. It is observed that with high temperature, the number of faults in the solder alloy used for tin and lead and for tin, silver, and copper were lower. 17 electronic assemblies with measures of 2 cm × 2 cm were fabricated, where components such as leads and electric resistance were used. The objective of analyzing this is to obtain the characteristics of the soldering alloy. Electronic components of this type are used worldwide in all types of electronic components, including: TVs, cell phones, tablet, computers, resistors, diodes, LEDs, and capacitors. For this work, the components were built based on an LED and a diode.