MWCNTs-GNPs Reinforced TPU Composites with Thermal and Electrical Conductivity: Low-Temperature Controlled DIW Forming

Author:

Duan Chenqi12,Long Fei23ORCID,Shi Xiaolu4,Wang Yuting2,Dong Jiajing2,Ying Songtao2,Li Yesheng1,Cheng Yuchuan2ORCID,Guo Jianjun2,Xu Gaojie2,Sun Aihua2

Affiliation:

1. Ganzhou Key Laboratory of Advanced Metals and Functional Materials, School of Materials Science and Engineering, Jiangxi University of Science and Technology (JXUST), 86 Hongqi Road, Ganzhou 341000, China

2. Key Laboratory of Additive Manufacturing Materials of Zhejiang Province, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China

3. Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham, Ningbo 315100, China

4. Ningbo New Material Testing and Evaluation Center Co., Ltd., Ningbo 315201, China

Abstract

As an effective technique for fabricating conductive and thermally conductive polymer composites, a multi-filler system incorporates different types and sizes of multiple fillers to form interconnected networks with improved electrical, thermal, and processing properties. In this study, DIW forming of bifunctional composites was achieved by controlling the temperature of the printing platform. The study was based on enhancing the thermal and electrical transport properties of hybrid ternary polymer nanocomposites with multi-walled carbon nanotubes (MWCNTs) and graphene nanoplates (GNPs). With thermoplastic polyurethane (TPU) used as the matrix, the addition of MWCNTs, GNPs and both mixtures further improved the thermal conductivity of the elastomers. By adjusting the weight fraction of the functional fillers (MWCNTs and GNPs), the thermal and electrical properties were gradually explored. Here, the thermal conductivity of the polymer composites increased nearly sevenfold (from 0.36 W·m−1·k−1 to 2.87 W·m−1·k−1) and the electrical conductivity increased up to 5.49 × 10−2 S·m−1. It is expected to be used in the field of electronic packaging and environmental thermal dissipation, especially for modern electronic industrial equipment.

Funder

National Key Research and Development Project

National Natural Science Foundation of China

Zhejiang Provincial Natural Science Foundation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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