Research on Abrasive Water Jet Polishing of Silicon Carbide Based on Fluid Self-Excited Oscillation Pulse Characteristics

Abstract

A self-excited oscillating pulsed abrasive water jet polishing method is proposed to solve the problems of low removal efficiency in traditional abrasive water jet polishing and the influence of an external flow field on the material surface removal rate. The self-excited oscillating chamber of the nozzle was used to generate pulsed water jets to reduce the impact of the jet stagnation zone on material surface removal and increase the jet speed to improve processing efficiency. ANSYS Fluent was employed to simulate the processing flow field characteristics for different lengths of oscillation cavities. The simulation results indicate that the velocity of the jet shaft reached a maximum of 178.26 m/s when the length of the oscillation cavity was 4 mm. The erosion rate of the material is linear with the processing angle. A nozzle with a length of 4 mm of the self-excited oscillating cavity was fabricated for SiC surface polishing experiments. The results were compared with those of ordinary abrasive water jet polishing. The experimental results showed that the self-excited oscillation pulse fluid enhanced the erosion ability of the abrasive water jet on the SiC surface and significantly improved the material-removal depth of the abrasive water jet polishing SiC. The maximum surface erosion depth can be increased by 26 μm.