Biot–Savart-Based Design and Workbench Validation at 100 MHz of Transverse Field Surface RF Coils

Author:

Giovannetti Giulio1ORCID,Alecci Marcello234ORCID,Galante Angelo234ORCID

Affiliation:

1. Institute of Clinical Physiology, National Research Council (CNR), 56124 Pisa, Italy

2. Department of Life, Health & Environmental Sciences (MESVA), University of L’Aquila, 67100 L’Aquila, Italy

3. Gran Sasso National Laboratory, Istituto Nazionale di Fisica Nucleare, 67100 L’Aquila, Italy

4. SPIN-CNR, c/o Department of Physical and Chemical Science, University of L’Aquila, 67100 L’Aquila, Italy

Abstract

Radiofrequency (RF) surface coils are extensively used as receivers in magnetic resonance imaging (MRI) and magnetic resonance spectroscopy (MRS) systems thanks to their high signal-to-noise ratio (SNR). For specific magnetic resonance applications, the design of dedicated RF surface coils with a transverse (to the coil’s plane) RF magnetic field pattern can be necessary. Such transverse-field RF coils are constituted by several central linear (parallel or crossing) conductor elements connected by return current paths. Typically, the outer shape of such RF coils is circular or squared, although other geometries can be used. This paper describes the implementation and validation of a transverse-field RF surface coil simulator based on magnetostatic analysis, which permits the design and optimization of square butterfly and figure-of-eight RF coils with adjustable size and mutual distance between the central linear current elements. The simulation results, compared with the ones provided by a standard square loop RF coil, were validated with 100 MHz workbench measurements performed on three home-built prototypes. Finally, two novel quadrature RF coil structures designed by overlapping two orthogonal square butterfly and figure-of-eight RF coils were simulated and theoretically characterized. The RF coils described here should be suitable for a wide range of MRI/MRS preclinical/clinical applications, mainly at fields below 3 T.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

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