Optimization of the Ablative Laser Cutting of Shadow Mask for Organic FET Electrode Fabrication

Abstract

This article presents an ablative method of cutting masks from ultra-thin metal foils using nanosecond laser pulses. As a source of laser radiation, a pulsed fiber laser with a wavelength of 1062 nm with the duration of pulses from 15 to 220 nanoseconds (ns), was used in the research. The masks were made of stainless-steel foil with thicknesses of 30 µm, 35 µm, and 120 µm. Channels of different lengths from 50 to 300 µm were tested. The possibilities and limitations of the presented method are described. The optimization of the cutting process parameters was performed using the experiment planning techniques. A static, determined complete two-level plan (SP/DC 24) was used. On the basis of the analysis of the test structures, we designed and produced precise shading masks used in the process of organic field effect transistor (OFET) electrode evaporation. The ablative method proved suitable to produce masks with canals of minimum lengths of 70 µm. It offers facile, fast, and economically viable shadow mask fabrication for organic electronics applications, which moreover might enable fast prototyping and circuit design.