VES-BJT: A Lateral Bipolar Transistor on SOI with Polysilicon Emitter and Collector

Author:

Mierzwinski Piotr1,Kuzmicz Wieslaw1ORCID

Affiliation:

1. Faculty of Electronics and Information Technology, Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, 00-661 Warsaw, Poland

Abstract

This paper summarizes the results of investigations of bipolar transistors made in VESTIC (Vertical Slit Transistor-based Integrated Circuits) technology. This technology was proposed by W. Maly as an alternative to classical bulk CMOS technology. However, the basic VESTIC cell can be used not only to make field effect transistors but also to make bipolar transistors. Their structures differ in many ways from existing structures of bipolar transistors. The investigations reported here aim to answer the question: can VESTIC-based lateral bipolar transistors be useful as active devices, and can they be made technologically compatible with field effect VESTIC devices? The theoretical studies were followed by the fabrication and measurements of VESTIC-based p-n-p and n-p-n bipolar devices. Although the manufacturing technology available was far from optimal, working bipolar devices were obtained. The results show that VESTIC-based bipolar devices may achieve acceptable parameters if made with state-of-the-art manufacturing technology. The main outcome of the research reported in the paper is that p-n-p and n-p-n bipolar transistors with acceptable parameters may be fabricated, together with field effect devices, in VESTIC-based integrated circuits. As a result, the VESTIC technology could become the new original BiCMOS technology.

Funder

National Centre for Research and Development

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

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5. Nakazato, K., Nakamura, T., Miyazaki, T., Okabe, T., and Nagata, M. (1982, January 1–3). SICOS—A High Performance Bipolar Structure for VLSI. Proceedings of the 1982 Symposium on VLSI Technology, Oiso, Japan.

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