Gold/Polyimide-Based Resistive Strain Sensors

Author:

Han TaoORCID,Nag Anindya,Afsarimanesh Nasrin,Akhter Fowzia,Liu Hangrui,Sapra Samta,Mukhopadhyay Subhas,Xu Yongzhao

Abstract

This paper presents the fabrication and implementation of novel resistive sensors that were implemented for strain-sensing applications. Some of the critical factors for the development of resistive sensors are addressed in this paper, such as the cost of fabrication, the steps of the fabrication process which make it time-consuming to complete each prototype, and the inability to achieve optimised electrical and mechanical characteristics. The sensors were fabricated via magnetron sputtering of thin-film chromium and gold layer on the thin-film substrates at defined thicknesses. Sticky copper tapes were attached on the two sides of the sensor patches to form the electrodes. The operating principle of the fabricated sensors was based on the change in their responses with respect to the corresponding changes in their relative resistance as a function of the applied strain. The strain-induced characteristics of the patches were studied with different kinds of experiments, such as consecutive bending and pressure application. The sensors with 400 nm thickness of gold layer obtained a sensitivity of 0.0086 Ω/ppm for the pressure ranging between 0 and 400 kPa. The gauge factor of these sensors was between 4.9–6.6 for temperatures ranging between 25 °C and 55 °C. They were also used for tactile sensing to determine their potential as thin-film sensors for industrial applications, like in robotic and pressure-mapping applications. The results were promising in regards to the sensors’ controllable film thickness, easy operation, purity of the films and mechanically sound nature. These sensors can provide a podium to enhance the usage of resistive sensors on a higher scale to develop thin-film sensors for industrial applications.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

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