Compact Microstrip Line to Rectangular Waveguide Transition Using Corrugated Substrate Integrated Waveguide

Author:

Liu Zihao1ORCID,Yao Yuan1,Cheng Xiaohe1,Li Qi1

Affiliation:

1. Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing 100876, China

Abstract

To meet the packaging requirements of terahertz (THz) communication systems, a microstrip line (MSL) to rectangular waveguide (RWG) transition is proposed in this paper. In the transition, the MSL is connected to the corrugated substrate integrated waveguide (CSIW) by a tapered MSL for quasi-TEM to TE10-like mode conversion on substrate, which requires no via holes or shaped dielectric, and is easy to process in THz bands. Then, the CSIW is straightly connected to the RWG transformer and converted to standard RWG, resulting in a compact structure. The working principle of the proposed transition is analyzed, and the influence of several important parameters on the S-parameters of the transition is discussed. A single transition is designed for the 325–500 GHz operation, the S11 better than −14.5 dB and S21 better than −1.03 dB have been achieved in the entire frequency band.

Funder

BUPT Excellent Ph.D. Students Foundation

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

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