Design and Implementation of Multi-Channel Readout Circuits for Low-Temperature Environments
-
Published:2023-05-04
Issue:9
Volume:12
Page:2089
-
ISSN:2079-9292
-
Container-title:Electronics
-
language:en
-
Short-container-title:Electronics
Author:
Wang Fei1, Ji Xiaoxiao2, Guo Aiying1, Yin Luqiao1ORCID, Zhang Jianhua1
Affiliation:
1. School of Microelectronics, Shanghai University, Shanghai 201800, China 2. The Key Laboratory of Advanced Display and System Applications, Ministry of Education, Shanghai University, Shanghai 200072, China
Abstract
Infrared sensors and focal plane imaging arrays are among the most important types of devices in the field of aerospace applications. To effectively amplify the small signals collected by infrared sensors and focal plane imaging arrays for subsequent processing, a new multi-channel preamplifier circuit based on ultra-low temperatures was designed in this study to read the acquisition signals of such devices. The technology of an SMIC 180 nm CMOS with 1.8 V power was adopted to realize the circuit. Meanwhile, an eight-level adjustable gain switch was used to increase the selectivity of signal processing. According to the simulation’s results, the single-channel power consumption of the circuit in the 77 K ultra-low temperature environment was only 5.17 mW. The circuit could drive a large load of 200–400 pF with an open-loop gain of 131.4 dB, which showed excellent performance in driving large loads, providing high gain and consuming less power. Additionally, the circuit exhibited good aspects for front-end signal reading and processing of infrared sensors and focal plane arrays in extreme environments.
Funder
National Nature Science Foundation of China the Science and Technology Commission of Shanghai Municipality Program the Natural Science Foundation of Shanghai
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering
Reference37 articles.
1. Doyle, D.T., Lee, S., Stein, J., and Kessler, S.S. (2015, January 5–9). The Spacecraft SHM Experiment, Part 1: Development for Space Flight. Proceedings of the 23rd AIAA/AHS Adaptive Structures Conference, Kissimmee, FL, USA. 2. Bürsing, H., Ebert, R., Huckridge, D.A., and Rogalski, A. (2017). Electro-Optical and Infrared Systems: Technology and Applications XIV, SPIE. 3. Hua, L., Yong, K., Hu, H., and Zhang, Y. (2016, January 6–10). Integrated Electronic System of Spacecraft Based on SiP Technology. Proceedings of the 2016 IEEE 13th International Conference on Signal Processing (ICSP), Chengdu, China. 4. Bock, D., Laufer, P., and Tajmar, M. (2017, January 10–14). Revolutionary Propulsion for Future Spacecraft: Field Emission Thruster Developments at TU Dresden towards their First Flight Application. Proceedings of the 2017 30th International Vacuum Nanoelectronics Conference (IVNC), Regensburg, Germany. 5. Summary of Avionics Technologies;Blasch;IEEE Aerosp. Electron. Syst. Mag.,2015
|
|