A Dual Convolutional Neural Network with Attention Mechanism for Thermal Infrared Image Enhancement

Author:

Gao Pengfei1,Zhang Weihua1,Wang Zeyi1,Ma He1,Lyu Zhiyu2

Affiliation:

1. State Grib Jilin Electric Power Co., Ltd., Changchun Power Supply Company, Changchun 130041, China

2. School of Automation Engineering, Northeast Electric Power University, Jilin 132013, China

Abstract

In industrial applications, thermal infrared images, which are commonly used, often suffer from issues such as low contrast and blurred details. Traditional image enhancement algorithms are limited in their effectiveness in improving the visual quality of thermal infrared images due to the specific nature of the application. Therefore, we propose a dual Convolutional Neural Network (CNN) combined with an attention mechanism to address the challenges of enhancing low-quality thermal infrared images and improving their visual quality. Firstly, we employ two parallel sub-networks to extract both global and local features. In one sub-network, we utilize a sparse mechanism incorporating dilated convolutions, while the other sub-network employs Feature Attention (FA) blocks based on channel attention and pixel attention. This architecture significantly enhances the feature extraction capability. The use of attention mechanisms allows the network to filter out irrelevant background information, enabling more flexible feature extraction. Finally, through a simple yet effective fusion block, we thoroughly integrate the extracted features to achieve an optimal fusion strategy, ensuring the highest quality enhancement of the final image. Extensive experiments on benchmark datasets and real images demonstrate that our proposed method outperforms other state-of-the-art models in terms of objective evaluation metrics and subjective assessments. The generated images also exhibit superior visual quality.

Funder

State Grid Jilin Electric Power Co., LTD.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

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