Abstract
An integrated-circuit testing model (DITM) is used to describe various factors that affect test yield during a test process. We used a probability distribution model to evaluate test yield and quality and introduced a threshold test and a guardband test. As a result of the development speed of the semiconductor manufacturing industry in the future being unpredictable, we use electrical properties of existing products and the current manufacturing technology to estimate future product-distribution trends. In the development of very-large-scale integration (VLSI) testing, the progress of testing technology is very slow. To improve product testing yield and quality, we change the test method and propose an unbalanced-test method, leading to improvements in test results. The calculation using our proposed model and data estimated by the product published by the IEEE International Roadmap for Devices and Systems (IRDS, 2017) proves that the proposed unbalanced-test method can greatly improve test yield and quality and achieve the goal of high-quality, near-zero-defect products.
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering
Reference25 articles.
1. Repeated Testing Applications for Improving the IC Test Quality to Achieve Zero Defect Product Requirements
2. International Technology Roadmap for Semiconductors, Test and Test Equipment
http://cva.stanford.edu/classes/cs99s/papers/roadmap1999.pdf
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