Advances in Modeling and Suppression Methods of EMI in Power Electronic Converters of Third-Generation Semiconductor Devices

Author:

Wu Xiaogang12ORCID,Gao Xinjia2,Wang Jiulong2ORCID,Li Zheng2,Du Shirui2,Gao Shuchun2,Li Feiqiang3ORCID,Du Jiuyu4,Shchurov Nickolay I.5,Zhang Xinyang67

Affiliation:

1. National Rail Transit Electrification and Automation Engineering Technique Research Center, Southwest Jiaotong University, Chengdu 611756, China

2. School of Electrical and Electronic Engineering, Harbin University of Science and Technology, Harbin 150080, China

3. Beijing Sinohytec Co., Ltd., Beijing 100084, China

4. State Key Laboratory of Automotive Safety and Energy, Tsinghua University, Beijing 100084, China

5. Department of Electrical Engineering Complexes, Novosibirsk State Technical University, Novosibirsk 630073, Russia

6. School of Mechanical Engineering, University of Science and Technology Beijing, Beijing 100083, China

7. Shunde Innovation School, University of Science and Technology Beijing, Foshan 528399, China

Abstract

With the development of high-frequency, miniaturized, and lightweight power electronic devices, third-generation semiconductor devices are more and more used in the main circuits of power electronic converters. The electromagnetic interference (EMI) generated by their fast switching can affect the performance of power electronic converters. Therefore, it is necessary to investigate the modeling and suppression methods of conducted noise in power electronic converters of third-generation semiconductor devices. This paper describes the EMI sources and coupling paths of EMI in third-generation semiconductor devices used in power electronic converters. The modeling methods of EMI are summarized from the perspectives of power devices and coupling paths. The suppression methods of conducted noise are summarized by suppressing EMI sources and improving coupling path characteristics. This paper provides a reference for the electromagnetic compatibility design of power electronic converters for third-generation semiconductor devices.

Funder

Chengdu Guojia Electrical Engineering Co., Ltd.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

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