The Impact of Technological Parameters on the Quality of Inkjet-Printed Structures

Author:

Kiliszkiewicz Milena1ORCID

Affiliation:

1. Faculty of Electronics, Photonics and Microsystems, Wrocław University of Science and Technology, Janiszewskiego 11/17, 50-372 Wroclaw, Poland

Abstract

Printing electronics is emerging as one of the fastest-growing engineering technologies that are increasingly used and reliable. It provides an alternative to manufacturing electronics devices based on silicon compounds. This article discusses its challenges, problems, and ways of obtaining desired features efficiently and inexpensively. The influence of the most important parameters of the drop-on-demand (DOD) inkjet printing process on the quality of the conductive layers, together with the results of their ageing tests, is illustrated and discussed in terms of their applicability to general-purpose electronics circuits.

Funder

internal sources of Wroclaw University of Science and Technology

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

Reference39 articles.

1. (2023, January 20). Available online: https://www.scopus.com/.

2. Technologies for printing sensors and electronics over large flexible substrates: A review;Khan;IEEE Sens. J.,2015

3. Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems;Zikulnig;Adv. Sens. Res.,2023

4. Fabrication of Screen-Printed Electrodes: Opportunities and Challenges;Suresh;J. Mater. Sci.,2021

5. Inkjet deposited circuit components;Bidoki;J. Micromech. Microeng.,2010

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3