Review of Methods for PCB Panel Depanelization and Methods for Correct Assembly of Electronic Components on PCB Panels

Abstract

Currently, processes related to PCBs (printed circle board), such as depanelization and checking the correct functioning of the boards, are carried out in separate devices. The purpose of this article is to review the literature and analyze trends related to these aspects of PCB panel manufacturing. The purpose of this analysis is to indicate the currently used depanelization methods and methods for checking the correctness of the assembly of electronic circuits on PCB panels. The publications were found in such knowledge bases as Scopus, IEEE Xplore or Emerald insight. In the following article, a systematic literature analysis along with a mapping study is used. This publication provides a review of selected scientific papers found in the above-mentioned databases. Based on these analyses, insights related to future work on both aspects of PCBs were presented. These insights are part of the development of new integrated devices for depanelization and verification of PCBs.