4H-SiC/SiO2 Interface Degradation in 1.2 kV 4H-SiC MOSFETs Due to Power Cycling Tests

Author:

Yoo Dahui1ORCID,Kim MiJin2ORCID,Kang Inho3,Lee Ho-Jun1

Affiliation:

1. Department of Electrical Engineering, Pusan National University, Busan 46284, Republic of Korea

2. Quality Team, Test & System Package, Samsung Electronics, Asan 31489, Republic of Korea

3. Korean Electrotechnology Research Institute, Changwon 51543, Republic of Korea

Abstract

Power cycling tests (PCTs) assess the reliability of power devices by closely simulating their operating conditions. A PCT was performed on commercially available 1.2 kV 4H-SiC power metal–oxide–semiconductor field-effect transistors to observe its impact on the 4H-SiC/SiO2 interface. High-resolution transmission electron microscopy and electron energy loss spectroscopy measurements showed variations in the length of the 4H-SiC/SiO2 transition layer, depending on whether the device was power cycled. Moreover, the total resistance at Vg≫ Vt in Rtot − (Vg-Vt)−1 graph increased to 16.5%, while it changed more radically to 47.3% at Vg≈ Vt. The threshold voltage shifted negatively. These variations cannot be expected solely through the wearout of the package.

Funder

Korea Institute for Advancement of Technology

Publisher

MDPI AG

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