Preparation of Biobased Printed Circuit Board Prototypes Using Poly(furfuryl alcohol) Resin

Author:

Carrigan Aidan M.1,Valentine Joseph1,Viitaniemi Maria L. K.2ORCID,Frost Kali2,Nguyen Bichlien H.2,Lincoln John D.1,Tontisakis Antonios1ORCID

Affiliation:

1. Axiom Materials, Inc., 2320 Pullman Street, Santa Ana, CA 92705-5507, USA

2. Microsoft Corporation, One Microsoft Way, Redmond, WA 98052-6399, USA

Abstract

The present study explores the processability and properties of poly(furfuryl alcohol) (PFA)-based composites and draws comparisons with the industry-standard epoxy resin matrices used in printed circuit board applications. A poly(furfuryl alcohol)-based fiberglass prepreg was used to manufacture composite cores laminated with copper foil, which were then integrated in situ into printed circuit board prototypes through industry-typical manufacturing and assembly processes. Both copper cores and printed boards were tested to characterize the electrical properties and overall quality of the prototypes. The fabrication of the copper cores and manufacturing methods of the printed boards are described, alongside the results from the characterization of the cores and the testing of the printed boards. The inherent advantages and disadvantages of the material are highlighted, and areas of improvement for the processability of the material and reliability of the technology are discussed.

Funder

participating companies

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering

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5. Kosbar, L.L., and Gelorme, J. (2017, January 5–7). Biobased epoxy resins for computer components and printed wiring boards. Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, San Francisco, CA, USA.

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