Test for Reliability for Mission Critical Applications
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Published:2021-08-17
Issue:16
Volume:10
Page:1985
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ISSN:2079-9292
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Container-title:Electronics
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language:en
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Short-container-title:Electronics
Author:
Pipponzi Mauro,Sangiovanni-Vincentelli Alberto
Abstract
Test for Reliability is a test flow where an Integrated Circuit (IC) device is continuously stressed under several corner conditions that can be dynamically adapted based on the real-time observation of the critical signals of the device during the evolution of the test. We present our approach for a successful Test-for-Reliability flow, going beyond the objectives of the traditional reliability approach, and covering the entire process from design to failure analysis.
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Hardware and Architecture,Signal Processing,Control and Systems Engineering