Affiliation:
1. Beijing Zhixin Microelectronics Technology Co., Ltd., Beijing 102299, China
2. School of Electronics and Information Engineering, Beihang University, Beijing 100191, China
Abstract
With the system interconnection and intelligence of application scenario equipment, the electromagnetic environment of chips is becoming more and more complex. Problems such as communication interruption and data loss caused by electromagnetic interference often occur. The electromagnetic reliability of chips has become an important index to measure their availability. In order to effectively detect the electromagnetic reliability of industrial chips applied to specific scenarios, it is necessary to measure and analyze the electromagnetic characteristics of the application scenarios, as the boundary conditions of the electromagnetic protection simulation analysis and design of the chip, and to develop Electromagnetic Compatibility (EMC) test items, test limits and test methods suitable for carrying out tests and monitoring on chips. The paper presents an acquisition system, which can complete the collection of transient electromagnetic interference, steady electromagnetic field, temperature, humidity and near-field data. The transient interference measurement frequency range is 300 kHz–500 MHz, with a rising edge of 1.5 ns; the steady-state electromagnetic field measurement frequency ranges from 100 Hz to 3 GHz. By collecting the electromagnetic environmental characteristics of chips and analyzing situations in which chips are prone to interference, protective measures can be implemented.
Funder
Beijing Smart-chip Microelectronics Technology Co., Ltd.
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