TSG-SLAM: SLAM Employing Tight Coupling of Instance Segmentation and Geometric Constraints in Complex Dynamic Environments

Author:

Zhang Yongchao1ORCID,Li Yuanming23,Chen Pengzhan13ORCID

Affiliation:

1. School of Intelligent Manufacturing, Taizhou University, Taizhou 318000, China

2. Department of Electrical Engineering, Ganzhou Polytechnic, Ganzhou 341000, China

3. School of Electrical and Automation Engineering, East China Jiaotong University, Nanchang 330013, China

Abstract

Although numerous effective Simultaneous Localization and Mapping (SLAM) systems have been developed, complex dynamic environments continue to present challenges, such as managing moving objects and enabling robots to comprehend environments. This paper focuses on a visual SLAM method specifically designed for complex dynamic environments. Our approach proposes a dynamic feature removal module based on the tight coupling of instance segmentation and multi-view geometric constraints (TSG). This method seamlessly integrates semantic information with geometric constraint data, using the fundamental matrix as a connecting element. In particular, instance segmentation is performed on frames to eliminate all dynamic and potentially dynamic features, retaining only reliable static features for sequential feature matching and acquiring a dependable fundamental matrix. Subsequently, based on this matrix, true dynamic features are identified and removed by capitalizing on multi-view geometry constraints while preserving reliable static features for further tracking and mapping. An instance-level semantic map of the global scenario is constructed to enhance the perception and understanding of complex dynamic environments. The proposed method is assessed on TUM datasets and in real-world scenarios, demonstrating that TSG-SLAM exhibits superior performance in detecting and eliminating dynamic feature points and obtains good localization accuracy in dynamic environments.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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