Comparison of 3D Sensors for Automating Bolt-Tightening Operations in the Automotive Industry

Author:

Dias Joana1ORCID,Simões Pedro2,Soares Nuno2,Costa Carlos M.13ORCID,Petry Marcelo R.1ORCID,Veiga Germano1ORCID,Rocha Luís F.1ORCID

Affiliation:

1. INESC TEC—INESC Technology and Science, 4200-465 Porto, Portugal

2. Europneumaq—Soluções Industriais, 4410-052 Serzedo, Portugal

3. Faculty of Engineering, University of Porto (FEUP), 4200-465 Porto, Portugal

Abstract

Machine vision systems are widely used in assembly lines for providing sensing abilities to robots to allow them to handle dynamic environments. This paper presents a comparison of 3D sensors for evaluating which one is best suited for usage in a machine vision system for robotic fastening operations within an automotive assembly line. The perception system is necessary for taking into account the position uncertainty that arises from the vehicles being transported in an aerial conveyor. Three sensors with different working principles were compared, namely laser triangulation (SICK TriSpector1030), structured light with sequential stripe patterns (Photoneo PhoXi S) and structured light with infrared speckle pattern (Asus Xtion Pro Live). The accuracy of the sensors was measured by computing the root mean square error (RMSE) of the point cloud registrations between their scans and two types of reference point clouds, namely, CAD files and 3D sensor scans. Overall, the RMSE was lower when using sensor scans, with the SICK TriSpector1030 achieving the best results (0.25 mm ± 0.03 mm), the Photoneo PhoXi S having the intermediate performance (0.49 mm ± 0.14 mm) and the Asus Xtion Pro Live obtaining the higher RMSE (1.01 mm ± 0.11 mm). Considering the use case requirements, the final machine vision system relied on the SICK TriSpector1030 sensor and was integrated with a collaborative robot, which was successfully deployed in an vehicle assembly line, achieving 94% success in 53,400 screwing operations.

Funder

ERDF—European Regional Development Fund

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Biochemistry,Instrumentation,Atomic and Molecular Physics, and Optics,Analytical Chemistry

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