Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites

Author:

Xiao Bing1,Zheng Xinmei1,Zhao Yang1,Huang Bingxue1,He Pan2,Peng Biyou1,Chen Gang13ORCID

Affiliation:

1. School of Materials Science and Engineering, Xihua University, Chengdu 610039, China

2. Sichuan Provincial Engineering Research Center of Functional Development and Application of High Performance Special Textile Materials, Chengdu Textile College, Chengdu 611731, China

3. Sichuan Province Engineering Technology Research Center of Powder Metallurgy, Chengdu University, Chengdu 610106, China

Abstract

Efficient heat dissipation is vital for advancing device integration and high-frequency performance. Three-dimensional printing, famous for its convenience and structural controllability, facilitates complex parts with high thermal conductivity. Despite this, few studies have considered the influence of shear rate on the thermal conductivity of printed parts. Herein, polydimethylsiloxane/boron nitride (PDMS/BN) composites were prepared and printed by direct ink writing (DIW). In order to ensure the smooth extrusion of the printing process and the structural stability of the part, a system with 40 wt% BN was selected according to the rheological properties. In addition, the effect of printing speed on the morphology of BN particles during 3D printing was studied by XRD, SEM observation, as well as ANSYS Polyflow simulation. The results demonstrated that increasing the printing speed from 10 mm/s to 120 mm/s altered the orientation angle of BN particles from 78.3° to 35.7°, promoting their alignment along the printing direction due to the high shear rate experienced. The resulting printed parts accordingly exhibited an impressive thermal conductivity of 0.849 W∙m−1∙K−1, higher than the 0.454 W∙m−1∙K−1 of the control sample. This study provides valuable insights and an important reference for future developments in the fabrication of thermal management devices with customizable thermal conductivity.

Funder

Opening Foundation of Sichuan Province Engineering Technology Research Center of Powder Metallurgy, Chengdu University

Sichuan Science and Technology Program

“Young Scholars” Program

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

Reference40 articles.

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